Universal Server CPU Liquid Cooling Kit

The CPU liquid cooling cold plate has a standardized design for its appearance. The cold head is assembled with the bracket, meeting the liquid cooling requirements for chips such as Intel, AMD, and HYGON.

The inlet liquid temperature is supported from 40℃ to 55℃, with the CPU core temperature being less than 65℃.

Rapid heat dissipation and strong cooling capacity

Customized for multiple generations of server models, ensuring perfect compatibility.

Low flow resistance design, rapid coolant flow, and excellent heat dissipation effect.

Storage Liquid Cooling Heat Dissipation Kit

Heat is transferred through the liquid cooling vest to the memory cover, and then to the cold plate.

The card spring is designed with a lean approach, allowing it to be tightened without damaging the memory.

A thermal pad is added between the memory and the vest plate, ensuring close contact and insulation between the memory and the vest.

The liquid cooling vest is independently designed, supporting the independent insertion and removal of the memory.

Blade Server CPU Liquid Cooling Heat Dissipation Kit

Blade liquid cooling server, with simultaneous liquid cooling design for the CPU and memory, achieving precise cooling at the component level.

The liquid cooling heat dissipation capacity is 600W, capable of removing more than 85% of the heat through liquid cooling.

"Series + parallel" cold plates ensure more balanced chip temperature and performance.

Supports high inlet coolant temperatures ranging from 40°C to 50°C.

The liquid coolant can use an ethylene glycol water solution or deionized water.

Rack Server Liquid Cooling Cold Plate Kit

Rack-mount liquid cooling server, with liquid cooling design for the CPU, achieving precise cooling at the component level.

The liquid cooling heat dissipation capacity is 360W, capable of removing more than 50% of the heat through liquid cooling.

Differentiated design of the cold head ensures more balanced chip temperature and performance.

Supports high inlet coolant temperatures ranging from 40°C to 50°C.

The liquid coolant can use an ethylene glycol water solution or deionized water.

It features a leak detection design with automatic leak alarms.

Rack-mounted liquid cooling server, with liquid cooling design for CPU and memory within a 1U height, achieving precise cooling at the component level.

The liquid cooling heat dissipation capacity is 1500W, capable of removing more than 90% of the heat through liquid cooling.

The memory cooling component is independently designed, supporting independent insertion and removal of the memory.

The inlet coolant temperature is supported from 40℃ to 50℃.

The liquid coolant can use an ethylene glycol water solution or deionized water.

It has a leak detection design with automatic leak alarms.

AI Server Liquid Cooling Cold Plate Heat Dissipation Kit

[ PCIe Card Form ]

The liquid cooling design can simultaneously applied to CPU2 and X4/DCU28, with the entire system supporting a liquid cooling heat dissipation up to 3340W.

The Horizontal Coolant Distribution Unit (HCDU) is designed to be decoupled from the main unit, enabling independent maintenance of the PCIe card and convenient operation.

The HCDU features an integrated design with a height of 1U, and a 'top inlet and bottom outlet' structure, with the main inlet located in the center and nine branch outlets arranged on both ends. Eight of these are for the liquid cooling supply of PCIe cards, and one is for the CPU, achieving even flow distribution and balanced cooling performance.

The cold plate is made of a metal cold plate combined with a soft tube, welded into one unit, which is highly reliable and flexible for deployment.

The use of liquid coolant can achieve more than 85% of heat removal through liquid cooling.

The inlet coolant temperature is supported from 40°C to 50°C.

[ NV- link Form ]

Blade liquid cooling servers, with liquid cooling design for the DCU (Data Center Unit), achieve precise cooling at the component level.

The liquid cooling heat dissipation capacity is 800W, with more than 90% of the heat being removed by liquid cooling.

Differentiated design is applied to the cold head to balance chip temperature and performance. Supports high inlet coolant temperatures ranging from 40°C to 50°C.

The liquid coolant can be an ethylene glycol water solution or deionized water.

AI Server Liquid Cooling Cold Plate Heat Dissipation Kit

Dual-hard-disk exclusive design with modular hard-disk architecture.

The liquid cooling design for hard disks features a dual-disk capacity of 780W with an inlet temperature difference of 40°C to 50°C.

Supports hot-swapping of hard-disk bays with or without continuous coolant flow.

Incorporates a leak detection design with automatic leak alarms.

The coolant can be an ethylene glycol water solution, deionized water, or fluorinated liquid.

Cold Plate Liquid Cooling Server Diagnostic Equipment

Air Pressure Resistance Tester

Thermal and Flow Resistance

Tester Pulse Cleaning Equipment

Helium Mass Spectrometer Leak Detector

Fluid Connector

Cold plate liquid cooling servers utilize fluid connectors. A fluid connector is a type of joint that can establish or disconnect fluid pathways without the need for tools, preventing liquid leakage and supporting hot swapping of pipelines, ensuring that no coolant leaks during system installation or maintenance. Fluid connectors are selected based on different flow rates with varying diameter specifications; different materials are chosen based on fluid parameters; self-locking and blind mating forms are selected according to the system's locking method; and specific products are custom-developed based on special product requirements, etc.